TGV interposer
Through Glass Vias (TGV) formation allows to use glass as substrate for 3D integration for applications like RF modules and sensor packaging.
TGVi® expects TGV substrate in the use of 3D integration for semiconductor packaging, and other wide variety of fields
Through Glass Vias
for Semiconductor Packaging
Through Glass Vias (TGV) formation allows to use glass as substrate for 3D integration for applications like RF modules and sensor packaging.
TGVs expects TGV substrate in the use of 3D integration for semiconductor packaging, and other wide variety of fields.
- Glass material
- Boro 33, D263, AS87, Eagle XG, Quartz....
- Size
- Wafer: φ100mm, φ150mm, φ200mm
- Thickness
- 0.3mmT ~ 1mmT
- Hole type
- Through via, Blind via
- Hole shape
- Straight
- Hole diameter
- Φ25um ~
- Pitch
- Min. hole dia x 2
TGV Applications and Process Overview
