SOI Wafer

SOI Wafer (Silicon-on-Insulator)

An SOI (Silicon-on-Insulator) wafer consists of a thin silicon device layer separated from the silicon substrate
by a buried oxide (BOX) layer.
The BOX layer can serve as a sacrificial layer for releasing movable structures
in MEMS devices such as gyroscopes and accelerometers,
as well as an etch-stop or electrical isolation layer in various MEMS structures.
EPG provides SOI wafer fabrication based on its wafer bonding
and CMP (Chemical Mechanical Polishing) capabilities and dedicated process infrastructure.