TGV interposer
Through-glass via (TGV) technology enables glass substrates to be used for 3D integration
in applications such as RF modules and sensor packaging.
EPG's TGVi® technology provides TGV substrates for semiconductor packaging and a wide range of advanced packaging applications.
Through Glass Vias
for Semiconductor Packaging
Through-Glass Vias
for Semiconductor Packaging
TGV substrates offer excellent electrical insulation, dimensional
stability, and RF performance, making them well suited for advanced semiconductor packaging.
TGV technology enables high-density vertical interconnections through glass substrates and can be applied to RF devices, sensors, MEMS, and various 3D integration applications.
- Glass material
- Boro 33, D263, AS87, Eagle XG, Quartz....
- Item
- Specification
- Glass Material
- BOROFLOAT® 33, D 263®, AS87, EAGLE XG®, Quartz, etc.
- Wafer Size
- Ø100 mm, Ø150 mm, Ø200 mm
- Thickness
- 0.3–1.0 mm
- Via Type
- Through Via, Blind Via
- Via Profile
- Straight
- Via Diameter
- ≥ Ø25 µm
- Minimum Pitch
- 2× via diameter
TGV Applications and Process Overview
