TEG(Test Element Group) Wafer

A TEG (Test Element Group) Wafer is a test wafer used to determine the operational status of chips.
It can be manufactured according to customer designs for evaluation purposes needed in package development,
mounting method development, sample and inspection equipment development, and material development.
The TEG wafer is primarily created in a bump form by plating SnAg for soldering on a copper post type filler that can
accommodate fine pitches. Additionally, it can be produced to include the RDL process for electrical evaluation.