Process Service

Precision patterning from mask alignment to exposure and development. Supports 4-inch to 8-inch wafers.

Wet and dry etching. High-selectivity etching of various materials including silicon, oxide, and metal layers.

Metal deposition of Cu, Ni, Au, Al, and more. E-beam evaporating and sputtering processes.

Anodic bonding, eutectic bonding, fusion (direct) bonding, and more.

SiO₂ (oxide) formation. Diffusion (oxidation) process and services.

Electroplating and electroless plating (ENIG). Various metal plating including Cu, Ni, NiCo, Au, SnAg, and Sn.

Silicon and glass thickness processing. Thinning (grinding) and polishing processes.